solder ball

基本解释

With the same temperature on package, solder ball and PCB board, thermal cycling simulation ignores the thermal gradients in the whole assembly.
热循环模拟是在封装、焊球和PCB基板的任一节点上施加相同的温度载荷，忽略了整个封装体内温度梯度的存在。
Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.
介绍了激光重熔在面阵列封装钎料凸点成形中的研究进展，并且对PBGA共晶钎料球激光重熔进行了工艺研究。
Laser bumping is advantageous for its flexibility especially when used for individual solder ball rework and small or medium production of BGA packages, yet it hasn′t been vastly applied presently.
激光植球的优势在于它的柔性，它适宜于中小批量BGA的生产与个别焊球的修复，不过目前还没有投入大规模的应用。

焊球
Adaptive algorithm is used to realize IMC growth during simulation, and energy fatigue model is used to predict solder ball lifetime.
采用改进算法,在计算过程中引入了IMC厚度的变化,利用能量法预测了焊球寿命。
能源科学技术
焊点
The electromagnetic stirring was carried out in the process of solder joint formation in the lead-free solder ball and substrate by means of revolving permanent magnets. Consequently, some defects were found through analysis, causing negative impacts on solder joints reliability.
利用旋转永磁体法对无铅焊料球和基板在受热形成焊点的过程中实施电磁搅拌,试验之后,通过分析结果,发现该方法存在缺陷,对焊点可靠性有不利影响。
计算机科学技术
焊锡球